Semiconductor device manufacturing: process – Making passive device – Trench capacitor
Reexamination Certificate
2007-05-15
2007-05-15
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Making passive device
Trench capacitor
C438S396000, C438S240000, C438S785000
Reexamination Certificate
active
10928547
ABSTRACT:
The invention includes methods of forming hafnium-containing materials, such as, for example, hafnium oxide. In one aspect, a semiconductor substrate is provided, and first reaction conditions are utilized to form hafnium-containing seed material in a desired crystalline phase and orientation over the substrate. Subsequently, second reaction conditions are utilized to grow second hafnium-containing material over the seed material. The second hafnium-containing material is in a crystalline phase and/or orientation different from the crystalline phase and orientation of the hafnium-containing seed material. The second hafnium-containing material can be, for example, in an amorphous phase. The seed material is then utilized to induce a desired crystalline phase and orientation in the second hafnium-containing material. The invention also includes capacitor constructions utilizing hafnium-containing materials, and circuit assemblies comprising the capacitor constructions.
REFERENCES:
patent: 4490193 (1984-12-01), Ishaq et al.
patent: 5821556 (1998-10-01), Chew et al.
patent: 6537830 (2003-03-01), Arita et al.
patent: 6785120 (2004-08-01), Basceri et al.
Wolf et al, Silicon Processing for the VLSI Era, vol. 1, 1990, p. 1.
Basceri Cem
Gealy F. Daniel
Sandhu Gurtej S.
Micro)n Technology, Inc.
Trinh Michael
Wells St. John P.S.
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