Metal treatment – Process of modifying or maintaining internal physical... – Producing or treating layered – bonded – welded – or...
Reexamination Certificate
2005-02-01
2005-02-01
Kastler, Scott (Department: 1742)
Metal treatment
Process of modifying or maintaining internal physical...
Producing or treating layered, bonded, welded, or...
C148S554000, C148S652000
Reexamination Certificate
active
06849139
ABSTRACT:
The invention includes a method of forming a sputtering target containing copper of a purity of at least about 99.999 wt. %, and at least one component selected from the group consisting of Ag, Sn, Te, In, B, Bi, Sb, and P dispersed within the copper. The total of Ag, Sn, Te, In, B, Bi, Sb, and P within the copper is from at least 0.3 ppm to about 10 ppm. The sputtering target has a substantially uniform grain size of less than or equal to about 50 micrometers throughout the copper and the at least one component.
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Buehler Jane E.
Kardokus Janine K.
Parfeniuk Christopher L.
Wu Chi tse
Honeywell International , Inc.
Kastler Scott
Wells St. John P.S.
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