Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-01-20
2008-10-28
Lee, Calvin (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S642000
Reexamination Certificate
active
07442643
ABSTRACT:
A conductive element is formed on a substrate by forming an organometallic layer on at least a portion of a surface of the substrate, heating a portion of the organometallic layer, and removing an unheated portion of the organometallic layer. In other methods, a flowable, uncured conductive material may be deposited on a surface of the substrate, the flowable, uncured conductive material may be selectively cured over at least a portion of the surface of the substrate, and a portion of the cured conductive material may be removed. A conductive via is formed by forming a hole at least partially through a thickness of a substrate, depositing an organometallic material within at least a portion of the hole, and selectively heating at least a portion of the organometallic material.
REFERENCES:
patent: 3976288 (1976-08-01), Cuomo, Jr.
patent: 4463073 (1984-07-01), Miyauchi et al.
patent: 4575330 (1986-03-01), Hull
patent: 4925515 (1990-05-01), Yoshimura et al.
patent: 4929402 (1990-05-01), Hull
patent: 4996010 (1991-02-01), Modrek
patent: 4999143 (1991-03-01), Hull et al.
patent: 5015424 (1991-05-01), Smalley
patent: 5058988 (1991-10-01), Spence
patent: 5059021 (1991-10-01), Spence et al.
patent: 5059359 (1991-10-01), Hull et al.
patent: 5076974 (1991-12-01), Modrek et al.
patent: 5087964 (1992-02-01), Hatta
patent: 5096530 (1992-03-01), Cohen
patent: 5104592 (1992-04-01), Hull et al.
patent: 5123734 (1992-06-01), Spence et al.
patent: 5130064 (1992-07-01), Smalley et al.
patent: 5133987 (1992-07-01), Spence et al.
patent: 5141680 (1992-08-01), Almquist et al.
patent: 5143663 (1992-09-01), Layden et al.
patent: 5164128 (1992-11-01), Modrek et al.
patent: 5173220 (1992-12-01), Reiff et al.
patent: 5174931 (1992-12-01), Almquist et al.
patent: 5174943 (1992-12-01), Hull
patent: 5182055 (1993-01-01), Allison et al.
patent: 5182056 (1993-01-01), Spence et al.
patent: 5182715 (1993-01-01), Vorgitch et al.
patent: 5184307 (1993-02-01), Hull et al.
patent: 5192469 (1993-03-01), Smalley et al.
patent: 5192559 (1993-03-01), Hull et al.
patent: 5209878 (1993-05-01), Smalley et al.
patent: 5234636 (1993-08-01), Hull et al.
patent: 5236637 (1993-08-01), Hull
patent: 5238639 (1993-08-01), Vinson et al.
patent: 5248456 (1993-09-01), Evans, Jr. et al.
patent: 5256340 (1993-10-01), Allison et al.
patent: 5258146 (1993-11-01), Almquist et al.
patent: 5264061 (1993-11-01), Juskey et al.
patent: 5267013 (1993-11-01), Spence
patent: 5273691 (1993-12-01), Hull et al.
patent: 5321622 (1994-06-01), Snead et al.
patent: 5344298 (1994-09-01), Hull
patent: 5345391 (1994-09-01), Hull et al.
patent: 5358673 (1994-10-01), Heller et al.
patent: 5378508 (1995-01-01), Castro et al.
patent: 5439622 (1995-08-01), Pennisi et al.
patent: 5447822 (1995-09-01), Hull et al.
patent: 5460703 (1995-10-01), Nulman et al.
patent: 5481470 (1996-01-01), Snead et al.
patent: 5495328 (1996-02-01), Spence et al.
patent: 5501824 (1996-03-01), Almquist et al.
patent: 5547906 (1996-08-01), Badehi
patent: 5554336 (1996-09-01), Hull
patent: 5555476 (1996-09-01), Suzuki et al.
patent: 5556590 (1996-09-01), Hull
patent: 5569349 (1996-10-01), Almquist et al.
patent: 5569431 (1996-10-01), Hull
patent: 5571471 (1996-11-01), Hull
patent: 5573722 (1996-11-01), Hull
patent: 5600181 (1997-02-01), Scott et al.
patent: 5609812 (1997-03-01), Childers et al.
patent: 5609813 (1997-03-01), Allison et al.
patent: 5610824 (1997-03-01), Vinson et al.
patent: 5622634 (1997-04-01), Noma et al.
patent: 5630981 (1997-05-01), Hull
patent: 5637169 (1997-06-01), Hull et al.
patent: 5651934 (1997-07-01), Almquist et al.
patent: 5659478 (1997-08-01), Pennisi et al.
patent: 5667820 (1997-09-01), Heller et al.
patent: 5672312 (1997-09-01), Almquist et al.
patent: 5675402 (1997-10-01), Cho et al.
patent: 5676904 (1997-10-01), Almquist et al.
patent: 5688464 (1997-11-01), Jacobs et al.
patent: 5693144 (1997-12-01), Jacobs et al.
patent: 5695707 (1997-12-01), Almquist et al.
patent: 5705016 (1998-01-01), Senoo et al.
patent: 5711911 (1998-01-01), Hull
patent: 5776409 (1998-07-01), Almquist et al.
patent: 5779967 (1998-07-01), Hull
patent: 5814265 (1998-09-01), Hull
patent: 5818005 (1998-10-01), Pratt et al.
patent: 5827394 (1998-10-01), Lu
patent: 5833869 (1998-11-01), Haas et al.
patent: 5854748 (1998-12-01), Snead et al.
patent: 5855718 (1999-01-01), Nguyen et al.
patent: 5855836 (1999-01-01), Leyden et al.
patent: 5869354 (1999-02-01), Leedy
patent: 5885511 (1999-03-01), Heller et al.
patent: 5897825 (1999-04-01), Fruth et al.
patent: 5902537 (1999-05-01), Almquist et al.
patent: 5902538 (1999-05-01), Kruger et al.
patent: 5904889 (1999-05-01), Serbin et al.
patent: 5933190 (1999-08-01), Dierickx et al.
patent: 5937265 (1999-08-01), Pratt et al.
patent: 5943235 (1999-08-01), Earl et al.
patent: 5945058 (1999-08-01), Manners et al.
patent: 5953590 (1999-09-01), Piper et al.
patent: 5969424 (1999-10-01), Matsuki et al.
patent: 5985523 (1999-11-01), Patton
patent: 5998867 (1999-12-01), Jensen et al.
patent: 6039830 (2000-03-01), Park et al.
patent: 6048948 (2000-04-01), Tochioka
patent: 6099783 (2000-08-01), Scranton et al.
patent: 6140151 (2000-10-01), Akram
patent: 6150240 (2000-11-01), Lee et al.
patent: 6245646 (2001-06-01), Roberts
patent: 6251488 (2001-06-01), Miller et al.
patent: 6259962 (2001-07-01), Gothait
patent: 6266874 (2001-07-01), DiStefano et al.
patent: 6268584 (2001-07-01), Keicher et al.
patent: 6283997 (2001-09-01), Garg et al.
patent: 6284072 (2001-09-01), Ryan et al.
patent: 6297138 (2001-10-01), Rimai et al.
patent: 6303469 (2001-10-01), Larson et al.
patent: 6307243 (2001-10-01), Rhodes
patent: 6322598 (2001-11-01), Meuris et al.
patent: 6323295 (2001-11-01), Muhlebach et al.
patent: 6323436 (2001-11-01), Hedrick et al.
patent: 6326698 (2001-12-01), Akram
patent: 6337122 (2002-01-01), Grigg et al.
patent: 6344402 (2002-02-01), Sekiya
patent: 6353257 (2002-03-01), Huang
patent: 6391251 (2002-05-01), Keicher et al.
patent: 6399464 (2002-06-01), Muntifering et al.
patent: 6403168 (2002-06-01), Meyer et al.
patent: 6407334 (2002-06-01), Jimarez et al.
patent: 6417022 (2002-07-01), Hsiao
patent: 6432752 (2002-08-01), Farnworth
patent: 6465329 (2002-10-01), Glenn
patent: 6468891 (2002-10-01), Williams
patent: 6471806 (2002-10-01), McKenna et al.
patent: 6472294 (2002-10-01), Meuris et al.
patent: 6482576 (2002-11-01), Farnworth et al.
patent: 6483719 (2002-11-01), Bachman
patent: 6498074 (2002-12-01), Siniaguine et al.
patent: 6500746 (2002-12-01), Williams
patent: 6509636 (2003-01-01), Tsai et al.
patent: 6514798 (2003-02-01), Farnworth
patent: 6518662 (2003-02-01), Smith et al.
patent: 6521844 (2003-02-01), Fuerniss et al.
patent: 6524346 (2003-02-01), Farnworth
patent: 6524881 (2003-02-01), Tandy et al.
patent: 6529027 (2003-03-01), Akram et al.
patent: 6537482 (2003-03-01), Farnworth
patent: 6544465 (2003-04-01), Farnworth et al.
patent: 6544821 (2003-04-01), Akram
patent: 6544902 (2003-04-01), Farnworth
patent: 6549821 (2003-04-01), Farnworth et al.
patent: 6551906 (2003-04-01), Oka
patent: 6562278 (2003-05-01), Farnworth et al.
patent: 6562661 (2003-05-01), Grigg
patent: 6569373 (2003-05-01), Napadensky
patent: 6569709 (2003-05-01), Derderian
patent: 6569753 (2003-05-01), Akram et al.
patent: 6582983 (2003-06-01), Runyon et al.
patent: 6585927 (2003-07-01), Grigg et al.
patent: 6593171 (2003-07-01), Farnworth
patent: 6607689 (2003-08-01), Farnworth
patent: 6611053 (2003-08-01), Akram
patent: 6632732 (2003-10-01), Williams
patent: 6644763 (2003-11-01), Gothait
patent: 6658314 (2003-12-01), Gothait
patent: 6677238 (2004-01-01), Seki
patent: 6686225 (2004-02-01), Wachtler
patent: 6696363 (2004-02-01), Lee et al.
patent: 6696752 (2004-02-01), Su et al.
patent: 6713857 (2004-03-01), Tsai
patent: 6734032 (2004-05-01), Tandy et al.
patent: 6740962 (2004-05-01), Grigg
patent: 6746899 (2004-06-01), Grigg
patent: 6762502 (2004-07-01), Akram
patent: 6764933 (2004-07-01), Williams
patent: 6764935 (2004-07-01), Williams
patent: 6767815 (2004-07-01), Williams
patent: 6780744 (2004-08-01), Williams
patent: 6833627 (2004-12-01), Farnworth
patent: 6849915 (2
Benson Peter A.
Farnworth Warren M.
Watkins Charles M.
Wood Alan G.
Lee Calvin
Micro)n Technology, Inc.
TraskBritt
LandOfFree
Methods of forming conductive elements using organometallic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods of forming conductive elements using organometallic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of forming conductive elements using organometallic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4017906