Methods of forming aluminum-comprising physical vapor...

Metal deforming – By extruding through orifice – With metal-deforming other than by extrusion

Reexamination Certificate

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C072S253100, C072S258000, C072S700000

Reexamination Certificate

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07017382

ABSTRACT:
The invention includes a method of forming an aluminum-comprising physical vapor deposition target. An aluminum-comprising mass is deformed by equal channel angular extrusion. The mass is at least 99.99% aluminum and further comprises less than or equal to about 1,000 ppm of one or more dopant materials comprising elements selected from the group consisting of Ac, Ag, As, B, Ba, Be, Bi, C, Ca, Cd, Ce, Co, Cr, Cu, Dy, Er, Eu, Fe, Ga, Gd, Ge, Hf, Ho, In, Ir, La, Lu, Mg, Mn, Mo, N, Nb, Nd, Ni, O, Os, P, Pb, Pd, Pm, Po, Pr, Pt, Pu, Ra, Rf, Rh, Ru, S, Sb, Sc, Se, Si, Sm, Sn, Sr, Ta, Tb, Te, Ti, Tl, Tm, V, W, Y, Yb, Zn and Zr. After the aluminum-comprising mass is deformed, the mass is shaped into at least a portion of a sputtering target. The invention also encompasses a physical vapor deposition target consisting essentially of aluminum and less than or equal to 1,000 ppm of one or more dopant materials comprising elements selected from the group consisting of Ac, Ag, As, B, Ba, Be, Bi, C, Ca, Cd, Ce, Co, Cr, Cu, Dy, Er, Eu, Fe, Ga, Gd, Ge, Hf, Ho, In, Ir, La, Lu, Mg, Mn, Mo, N, Nb, Nd, Ni, O, Os, P, Pb, Pd, Pm, Po, Pr, Pt, Pu, Ra, Rf, Rh, Ru, S, Sb, Sc, Se, Si, Sm, Sn, Sr, Ta, Tb, Te, Ti, Tl, Tm, V, W, Y, Yb, Zn and Zr. Additionally, the invention encompasses thin films.

REFERENCES:
patent: 4992087 (1991-02-01), Holscher
patent: 5160388 (1992-11-01), Legresy et al.
patent: 5456815 (1995-10-01), Fukuyo et al.
patent: 5500301 (1996-03-01), Onishi et al.
patent: 5513512 (1996-05-01), Segal
patent: 5541007 (1996-07-01), Ueda et al.
patent: 5590389 (1996-12-01), Dunlop et al.
patent: 5600989 (1997-02-01), Segal et al.
patent: 5650958 (1997-07-01), Gallagher et al.
patent: 5764567 (1998-06-01), Parkin
patent: 5809393 (1998-09-01), Dunlop et al.
patent: 5850755 (1998-12-01), Segal
patent: 5923056 (1999-07-01), Lee et al.
patent: 6188176 (2001-02-01), Nakaya et al.
patent: 6399215 (2002-06-01), Zhu et al.
patent: 6423161 (2002-07-01), Yao et al.
patent: 6451179 (2002-09-01), Xu et al.
patent: 6569270 (2003-05-01), Segal
patent: 6605199 (2003-08-01), Perry et al.
patent: 6908517 (2005-06-01), Segal et al.
patent: 2001/0054457 (2001-12-01), Segal et al.
patent: 2002/0014406 (2002-02-01), Takashima
patent: 2002/0098616 (2002-07-01), Kordesch
patent: 2004/0022662 (2004-02-01), Lipkin et al.
patent: 521163 (1993-01-01), None
patent: 62-235451 (1987-10-01), None
patent: 62-240733 (1987-10-01), None
patent: 7-90566 (1995-04-01), None
patent: 07286268 (1995-10-01), None
patent: 8-64554 (1996-03-01), None
patent: 8-100255 (1996-04-01), None
patent: 2000-176606 (2000-06-01), None
patent: WO 98/24945 (1998-06-01), None
patent: WO 01/29279 (2001-04-01), None
Haupt et al., “Drift in film thickness uniformity arising from sputtering target recrystallization”, J. Vac. Sci. Technol. A 7(3), May/Jun 1989, pp. 23552358.
Ferrasse et al., “Development of a submicrometer-grained microstructure in aluminum 6061 using equal channel angular extrusion”, J. Mater. Res. vol. 12, No. 5, May 1997. pp. 1253-1261.
V.M. Segal. “Materials Processing by Simple Shear”, Materials Science and Engineering A. vol. 197. 1995, pp. 157-164. (Year is sufficiently early such that the month is not an issue).
F. J. Humphreys et al., “Developing stable fine-grain microstructures by large strain deformation”, Phil. Trans. R. Soc. Lond. A, Jun. 15, 1999, vol. 357 #1756, pp. 1663-1681.
S. Ferrasse et al., “Texture evolution during equal channel angular extrusion Part I. Effect of route, number of passes and initial texture”, Materials Science and Engineering, vol. 368, Mar. 15, 2004, pp. 28-40.
V.M. Segal, “Equal channel angular extrusion: from macromechanics to structure formation”, Materials Science & Engineering A271, Nov. 1, 1999, pp. 322-333.
Ruslan Z. Valiev et al., “SPD-Processed Ultra-Fine Grained Ti Materials for Medical Applications”, Advanced Materials & Processes, Dec. 2003, pp. 33-34.
Segal et al., “Plastic Working of Metals by Simple Shear”, Russian Metall. vol. 1, pp. 99-105, 1991.
M. Furukawa et al., “Microhardness Measurements and the Hall-Petch Relationship in a Al-Mg Alloy with Submicrometer Grain Size”, Acta Mater. vol. 44, No. 11, pp. 4619-4629, 1996.
Yoshinori Iwahashi et al., “Microstructural Characteristics of Ultrafine-Grained Aluminum Produced Using Equal-Channel Angular Pressing”, Metallurgical and Materials Transactions, vol. 29A, pp. 2245-2252, Sep. 1998.
S. Ferrasse et al., “ECAE Targets with Sub-Micron Grain Structures Improve Sputtering Performance and Cost-of-Ownership”, Semiconductor Manufacturing, vol. 4, Issue 10, Oct. 2003, pp. 76-92.
R.Z. Valiev et al., “Bulk Nanostructured materials from severe plastic deformation”, Progress in Materials Science, vol. 45, 2000, pp. 103-189.
R.Z. Valiev et al., “Plastic deformation of alloys with submicron-grained structure”, Materials Science and Engineering, A137 (1991) pp. 35-40.
Ferrasse et al., “Microstructure and Properties of Copper and Aluminum Alloy 3003 Heavily Worked by Equal Channel Angular Extrusion”, Metallurgical and Materials Transactions, vol. 28A, Apr. 1997, pp. 1047-1057.
“Aluminum and Aluminum Alloys”, ASM International, 1993, pp. 88-89 and 639.
V. M. Segal et al., “Processes of Plastic Structure Formation”, Science and Engineering, 1994, published in Russia, Chapters 1, 3 and 4, with Statement in Accordance with 37 CFR 1.98(a)(3)(i).

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