Methods of fabricating underfilled, encapsulated...

Details Methods of fabricating underfilled, encapsulated... Methods of fabricating underfilled, encapsulated...

2007-08-28

2007-08-28

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S015000, C438S025000, C438S026000, C438S051000, C438S055000, C438S064000, C438S112000, C438S124000, C438S126000, C438S127000, C257S790000

Reexamination Certificate

active

10191655

ABSTRACT:
An apparatus and method may be used for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective bond. The semiconductor die is attached to the carrier substrate with a plurality of discrete adhesive elements so as to provide a gap or standoff therebetween. Wire bonds may then be formed between bond pads on the semiconductor die to conductive pads or terminals on the carrier substrate. With this arrangement, a dielectric filler material is disposed in the gap or standoff to form a permanent bonding agent between the semiconductor die and the carrier substrate. By applying the dielectric filler material after forming the wire bonds, the dielectric filler material coats at least a portion of the wire bonds to stabilize the wire bonds and prevent wire sweep in an encapsulation process, such as transfer molding, performed thereafter.

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