Methods of fabricating image sensors and image sensors...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal

Reexamination Certificate

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C438S144000, C257SE27133

Reexamination Certificate

active

07927902

ABSTRACT:
A method of fabricating an image sensor may include providing a substrate including light-receiving and non-light-receiving regions; forming a plurality of gates on the non-light-receiving region; ion-implanting a first-conductivity-type dopant into the light-receiving region to form a first dopant region of a pinned photodiode; primarily ion-implanting a second-conductivity-type dopant, different from the first-conductivity-type dopant, into an entire surface of the substrate, using the gates as a first mask; forming spacers on both side walls of the gates; and secondarily ion-implanting the second-conductivity-type dopant into the entire surface of the substrate, using the plurality of gates including the spacers as a second mask, to complete a second dopant region of the pinned photodiode. An image sensor may include the substrate; a transfer gate formed on the non-light-receiving region; a first dopant region in the light-receiving region; and a second dopant region formed on a surface of the light-receiving region.

REFERENCES:
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patent: 2001/0055849 (2001-12-01), Pan et al.
patent: 2002/0197758 (2002-12-01), Chen et al.
patent: 2005/0001248 (2005-01-01), Rhodes
patent: 2005/0088556 (2005-04-01), Han
patent: 2005/0255641 (2005-11-01), Sugihara
patent: 2006/0284274 (2006-12-01), Lee et al.
patent: 2003-264279 (2003-09-01), None
patent: 1020050018512 (2005-02-01), None

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