Methods of fabricating contacts for semiconductor devices...

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into...

Reexamination Certificate

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C438S637000, C438S618000

Reexamination Certificate

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06953741

ABSTRACT:
Methods for fabricating a contact of a semiconductor device are provided by patterning an interlayer dielectric of the semiconductor device to form a contact hole that exposes a silicon-based region of a first impurity type. The exposed silicon-based region is doped with a gas containing an element of the first impurity type and a contact plug is formed in the contact hole. Contact structure for a semiconductor device are also provided that include an interlayer dielectric of the semiconductor device having a contact hole formed therein that exposes a silicon-based region of a first impurity type. A delta-doped region of the first impurity type is provided in the exposed silicon-based region. A contact plug is provided in the contact hole and on the delta-doped region.

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Van Zant, Peter, Microchip Fabrication, 4th ed. McGraw-Hill, pp. 333, 340-1.
Notice to Submit Response, Korean Application No. 10-2002-0081741, dated Aug. 30, 2004.

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