Methods of fabricating camera modules including aligning...

Details Methods of fabricating camera modules including aligning... Methods of fabricating camera modules including aligning...

2011-07-05

2011-07-05

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S067000, C438S069000, C438S075000, C257SE31127

Reexamination Certificate

active

07972889

ABSTRACT:
Example embodiments may provide a camera module including a high-resolution lens member and/or an image sensor chip that may be integrally formed, and a method of fabricating a camera module. Example embodiment camera modules may include a semiconductor package including an image sensor chip. A transparent substrate may include an upper plate portion and/or a supporting portion defined by a cavity under the upper plate portion, and the supporting portion may be attached on the semiconductor package. The upper plate portion may be spaced from the semiconductor package by the supporting portion. A lens member may be attached to the upper plate portion of the transparent substrate. A stop member may be formed on a top side of the transparent substrate and may expose a portion of the lens member.

REFERENCES:
patent: 6982437 (2006-01-01), Gallup et al.
patent: 2004/0130640 (2004-07-01), Fujimori
patent: 2006/0044450 (2006-03-01), Wolterink et al.
patent: 2008/0122055 (2008-05-01), Perkins
patent: 2002-372603 (2002-12-01), None
patent: 10-2004-0054525 (2004-06-01), None
patent: 10/2004-0068864 (2004-08-01), None
patent: 10-2005-0033987 (2005-04-01), None

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