Methods of fabricating a molded ball grid array

Details Methods of fabricating a molded ball grid array Methods of fabricating a molded ball grid array

2005-07-12

2005-07-12

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S127000, C438S613000

Reexamination Certificate

active

06916683

ABSTRACT:
A method and apparatus for encapsulating a BGA package. Specifically, a BGA package is encapsulated after the balls are attached to the package. The backside of the package having the balls disposed thereon may be completely covered by the encapsulant. The encapsulant is disposed in direct contact about a portion of the balls. A liner is provided to facilitate the formation of an unencapsulated portion of each ball. The unencapsulated portion may be used to couple the package to a system.

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