Methods of fabricating a micromechanical structure

Details Methods of fabricating a micromechanical structure Methods of fabricating a micromechanical structure

2006-06-13

2008-12-23

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

C438S780000, C257SE21026, C257SE21027

Reexamination Certificate

active

07468327

ABSTRACT:
Methods of fabricating a microelectromechanical structure are provided. An exemplary embodiment of a method of fabricating a microelectromechanical structure comprises providing a substrate. A first patterned sacrificial layer is formed on portions of the substrate, the first patterned sacrificial layer comprises a bulk portion and a protrusion portion. A second patterned sacrificial layer is formed over the first sacrificial layer, covering the protrusion portion and portions of the bulk portion of the first patterned sacrificial layer, wherein the second patterned sacrificial layer does not cover sidewalls of the first patterned sacrificial layer. An element layer is formed over the substrate, covering portions of the substrate, the first patterned sacrificial layer and second patterned sacrificial layer. The first and second patterned sacrificial layers are removed, leaving a microstructure on the substrate.

REFERENCES:
patent: 5638946 (1997-06-01), Zavracky
patent: 6617185 (2003-09-01), Geisberger
patent: 6621022 (2003-09-01), Ma et al.
patent: 6908781 (2005-06-01), Anderson et al.

Affiliated with

Also associated with

Rating

Methods of fabricating a micromechanical structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of fabricating a micromechanical structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of fabricating a micromechanical structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4039600