Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1996-06-27
1999-10-26
Peterson, Kenneth E.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
83 14, 83886, 156275005, 156379006, 438114, 438464, B32B 3118
Patent
active
059721545
ABSTRACT:
The present invention pertains to methods for dicing wafers which are capable of easily removing chips of an adhesive of a dicing tape adhering on the wafer during dicing by cleaning using cleaning water. One method of dicing a wafer includes sticking an adhesive member having a layer of adhesive on a surface of the wafer. An adhesive force of the adhesive member is reduced along a plurality of dicing lines on the wafer without reducing the adhesive force of the adhesive member between the plurality of dicing lines. After the adhesive force is reduced along the dicing lines, the wafer is diced along the plurality of dicing lines into a plurality of parts by a blade.
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Peterson Kenneth E.
Sony Corporation
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