Methods of configuring a proximity head that provides...

Details Methods of configuring a proximity head that provides... Methods of configuring a proximity head that provides...

2011-08-16

2011-08-16

Aftergut, Jeff H (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S292000, C137S56100R, C029S613000

Reexamination Certificate

active

07998304

ABSTRACT:
Methods configure a proximity head for conditioning fluid flow relative to a proximity head in processing of a surface of a wafer by a meniscus. The methods configure the head in one piece while maintaining head rigidity even as the head is lengthened for cleaning of large diameter wafers. The one-piece head configuring separates main fluid flows from separate flows of fluid relative to the wafer surface, with the separation being by a high resistance fluid flow configuration, resulting in substantially uniform fluid flows across increased lengths of the head in a unit for either fluid supply or return.

REFERENCES:
patent: 5041181 (1991-08-01), Brackett et al.
patent: 6954993 (2005-10-01), Smith et al.
patent: 2006/0124153 (2006-06-01), Yun et al.
patent: 2003-266030 (2003-09-01), None
patent: 10-2005-0026766 (2005-03-01), None

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