Etching a substrate: processes – Nongaseous phase etching of substrate – Relative movement between the substrate and a confined pool...
Reexamination Certificate
2006-06-20
2006-06-20
Norton, Nadine G. (Department: 1765)
Etching a substrate: processes
Nongaseous phase etching of substrate
Relative movement between the substrate and a confined pool...
C216S103000, C216S105000, C216S106000
Reexamination Certificate
active
07063800
ABSTRACT:
The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).
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Ding Ying
Redline Ronald N.
Retallick Richard C.
Wojtaszek Mark
Carmody & Torrance LLP
Tran Binh X.
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