Methods of bonding targets to backing plate members using galliu

Details Methods of bonding targets to backing plate members using galliu Methods of bonding targets to backing plate members using galliu

1996-07-19

1997-08-05

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429812, 20429821, 2282481, 2282629, 420489, 420560, C23C 1434

Patent

active

056538561

ABSTRACT:
Methods of solder bonding sputter targets to backing plate members and solder bonded target/backing plate assemblies are disclosed wherein a gallium containing solder paste is used to bond adjoining target and backing plate surfaces. This paste comprises a gallium or gallium alloy liquid component and a finely divided solid solution component comprising at least one metal from groups IB, VIII, and IVB of the periodic chart and at least one metal from groups IVA, IIIA and VA of the periodic chart. The solder paste is applied to the surfaces to be soldered and is allowed to solidify. A durable solder bond is formed that is capable of withstanding high temperatures on the order of about 500.degree. C. without failure.

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