Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor
Reexamination Certificate
2007-06-12
2007-06-12
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electroforming or composition therefor
C205S070000, C264S219000, C264S221000, C264S259000, C264S271100, C264S299000, C264S313000, C264S317000, C264S318000, C264S328100
Reexamination Certificate
active
10434315
ABSTRACT:
Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.
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Microfabrica Inc.
Smalley Dennis R.
Wong Edna
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