Methods of and apparatus for electrochemically fabricating...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating electrolytic or nonelectrolytic coating after it is...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C205S223000, C216S039000

Reexamination Certificate

active

07828952

ABSTRACT:
Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.

REFERENCES:
patent: 3620933 (1971-11-01), Grunwald et al.
patent: 5190637 (1993-03-01), Guckel
patent: 5824374 (1998-10-01), Bradley, Jr. et al.
patent: 6027630 (2000-02-01), Cohen
patent: 6197181 (2001-03-01), Chen
patent: 6235624 (2001-05-01), Sasaki et al.
patent: 6287968 (2001-09-01), Yu et al.
patent: 6355147 (2002-03-01), Griffiths et al.
patent: 6518664 (2003-02-01), Miyamoto
patent: 6562656 (2003-05-01), Ho
patent: 6572742 (2003-06-01), Cohen
patent: 6740222 (2004-05-01), Cohn
patent: 6858121 (2005-02-01), Basol
patent: 6998358 (2006-02-01), French et al.
patent: 7160429 (2007-01-01), Cohen et al.
patent: 7252861 (2007-08-01), Smalley
patent: 7372616 (2008-05-01), Bang et al.
patent: 7384530 (2008-06-01), Cohen et al.
patent: 7527721 (2009-05-01), Lembrikov et al.
patent: 2001/0014409 (2001-08-01), Cohen
patent: 2003/0127336 (2003-07-01), Cohen et al.
patent: 2003/0221968 (2003-12-01), Cohen et al.
patent: 2003/0222738 (2003-12-01), Brown et al.
patent: 2003/0234179 (2003-12-01), Bang
patent: 2004/0000489 (2004-01-01), Zhang et al.
patent: 2004/0004001 (2004-01-01), Cohen et al.
patent: 2004/0004002 (2004-01-01), Thompson et al.
patent: 2004/0007468 (2004-01-01), Cohen et al.
patent: 2004/0007470 (2004-01-01), Smalley
patent: 2004/0065550 (2004-04-01), Zhang
patent: 2004/0065555 (2004-04-01), Zhang
patent: 0567332 (1993-10-01), None
Cohen, et al., “EFAB: Batch Production of Functional, Fully-Dense Metal Parts with Micron-Scale Features”, Proc. 9th Solid Freeform Fabrication, The University of Texas at Austin, Aug. 1998, pp. 161.
Adam L. Cohen, et al., “EFAB: Rapid, Low-Cost Desktop Micromachining of High Aspect Ratio True 3-D MEMS”, Proc. 12th IEEE Micro Electro Mechanical Systems Workshop, IEEE, Jan. 17-21, 1999, pp. 244-251.
“Microfabrication—Rapid Prototyping's Killer Application”, Rapid Prototyping Report, CAD/CAM Publishing, Inc., Jun. 1999, pp. 1-5.
Adam L. Cohen, “3-D Micromachining by Electrochemical Fabrication”, Micromachine Devices, Mar. 1999, pp. 6-7.
Gang Zhang, et al., “EFAB: Rapid Desktop Manufacturing of True 3-D Microstructures”, Proc. 2nd International Conference on Integrated MicroNanotechnology for Space Applications, The Aerospace Co., Apr. 1999.
F. Tseng, et al., “EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures Using a Low-Cost Automated Batch Process”, 3rd International Workshop on High Aspect Ratio Microstructure Technology (HARMST'99), Jun. 1999.
Adam L. Cohen, et al., “EFAB: Low-Cost, Automated Electrochemical Batch Fabrication of Arbitrary 3-D Microstructures”, Micromachining and Microfabrication Process Technology, SPIE 1999 Symposium on Micromachining and Microfabrication, Sep. 1999.
F. Tseng, et al., “EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures Using a Low-Cost Automated Batch Process”, MEMS Symposium, ASME 1999 International Mechanical Engineering Congress and Exposition, Nov. 1999.
Adam L. Cohen, “Electrochemical Fabrication (EFABTM)”, Chapter 19 of the MEMS Handbook, edited by Mohamed Gad-El-Hak, CRC Press, 2002, pp. 19/1-19/23.
Harshbarger, Eric, “The Desk . . .”, http://www.ericharshbarger.org/lego/desk, Aug. 25, 2000.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods of and apparatus for electrochemically fabricating... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of and apparatus for electrochemically fabricating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of and apparatus for electrochemically fabricating... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4248494

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.