Methods including wafer grooves for reducing semiconductor wafer

Details Methods including wafer grooves for reducing semiconductor wafer Methods including wafer grooves for reducing semiconductor wafer

1998-11-10

2000-02-15

Bowers, Charles

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

438439, H01L 2176

Patent

active

060252502

ABSTRACT:
A method of preparing a semiconductor wafer includes the step of forming first and second layers of a first material on opposing respective first and second faces of the semiconductor wafer. The second layer of the first material is then removed from the second face of the semiconductor wafer. More particularly, the first material can be polysilicon. Warping of the semiconductor wafer can thus be reduced.

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