Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-03-22
2005-03-22
Graybill, David E. (Department: 2827)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
C438S025000, C438S026000, C438S051000, C438S055000, C438S064000, C438S106000, C438S112000, C438S122000, C438S124000, C438S126000, C438S127000, C264S272170
Reexamination Certificate
active
06869811
ABSTRACT:
A semiconductor device includes a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First, the dam prevents damage to the mold. Second, the dam prevents encapsulant packaging compound material from flowing onto the heat sink. The dam may be a gasket. The dam may also be a burr created by, for example, stamping the bottom of the heat sink. The dam may include copper, polyamides, and leadlock tape. The dam may be permanently connected to the heat sink or removed following packaging. The dam may be removed mechanically, through the use of heat, or during an electrolytic deflash cycle.
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Graybill David E.
Micro)n Technology, Inc.
TraskBritt
LandOfFree
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