Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-03-11
2008-03-11
Le, Thao X. (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S685000, C438S686000
Reexamination Certificate
active
10705579
ABSTRACT:
Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate deposition of copper on the barrier layer. Copper then is electrochemically deposited overlying the barrier layer.
REFERENCES:
patent: 5824599 (1998-10-01), Schacham-Diamand et al.
patent: 6214731 (2001-04-01), Nogami et al.
patent: 6300244 (2001-10-01), Itabashi et al.
patent: 6436267 (2002-08-01), Carl et al.
patent: 6486055 (2002-11-01), Jung et al.
patent: 6764950 (2004-07-01), Noguchi et al.
patent: 6790776 (2004-09-01), Ding et al.
patent: 7060617 (2006-06-01), Dubin et al.
patent: 7081370 (2006-07-01), Kumagai et al.
patent: 7135404 (2006-11-01), Baskaran et al.
patent: 2002/0076929 (2002-06-01), Lu et al.
patent: 2003/0068887 (2003-04-01), Shingubara et al.
D. Josell, D. Wheeler, C. Witt, and T.P. Moffat; “Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers”; Electrochemical and Solid-State Letters, vol. 6; Jun. 5, 2003; pp. C143-C145.
M.W. Lane, C.E. Murray, F.R. McFeely, P.M. Vereecken and R. Rosenberg; “Liner Materials for Direct Electrodeposition of Cu”; Applied Physics Letters, vol. 83, No. 12; Sep. 22, 2003; pp. 2330-2332.
O. Chyan, T.N. Arunagiri and T. Ponnuswamy; “Electrodeposition of Copper Thin Film on Ruthenium, A Potential Diffusion Barrier for Cu Interconnects”; Journal of the Electrochemical Society, vol. 150; Oct. 8, 2002; pp. C347-C350.
Drewery John
Kailasam Sridhar K.
Reid Jonathan D.
Sukamto Johanes H.
Webb Eric G.
Ingrassia Fisher & Lorenz P.C.
Le Thao X.
Rodgers Colleen E.
LandOfFree
Methods for the electrochemical deposition of copper onto a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods for the electrochemical deposition of copper onto a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for the electrochemical deposition of copper onto a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3923023