Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-03-11
2008-03-11
Le, Thao X. (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S685000, C438S686000
Reexamination Certificate
active
07341946
ABSTRACT:
Methods are provided for electrochemically depositing copper on a work piece. One method includes the step of depositing overlying the work piece a barrier layer having a surface and subjecting the barrier layer surface to a surface treatment adapted to facilitate deposition of copper on the barrier layer. Copper then is electrochemically deposited overlying the barrier layer.
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Drewery John
Kailasam Sridhar K.
Reid Jonathan D.
Sukamto Johanes H.
Webb Eric G.
Ingrassia Fisher & Lorenz P.C.
Le Thao X.
Novellus Systems Inc.
Rodgers Colleen E.
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