Methods for selectively removing adhesives from polyimide substr

Details Methods for selectively removing adhesives from polyimide substr Methods for selectively removing adhesives from polyimide substr

1985-12-09

1987-01-27

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 221, 134 2217, 156630, 156652, 156655, 156668, 156902, 252 795, 427 97, B44C 122, B29C 1708, C03C 1500, C23F 102

Patent

active

046392904

ABSTRACT:
Methods for forming holes of predetermined size in polyimide substrates having metallic layers adhesively attached thereto include selectively removing areas of desired size and shape from the metallic layer; contacting the exposed adhesive layer with a selective etchant therefor that does not affect the polyimide substrate or undercut the adhesive near the opening formed; and selectively etching the polyimide substrate exposed in the openings by removal of the adhesive layer overlying the polyimides. These methods permit rapid, efficient formation of holes having a diameter as small as one mil (0.00254 cm).

REFERENCES:
patent: 3868720 (1975-02-01), New et al.
patent: 4078096 (1978-03-01), Redmond et al.
patent: 4112139 (1978-09-01), Shirk et al.
patent: 4346125 (1982-08-01), Kinshian et al.
patent: 4426253 (1984-01-01), Kreug et al.
"A Novel Polyimide Film Preparation & its Preferential-Like Chemical Etching Techniques for GaAs Devices" Journal Electro-Chemical Society, vol. 130, pp. 129-134, (1983).

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