Methods for securing components of semiconductor device...

Details Methods for securing components of semiconductor device... Methods for securing components of semiconductor device...

2007-09-11

2007-09-11

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S106000, C257SE21008, C257S499000, C257S514000

Reexamination Certificate

active

11242557

ABSTRACT:
A method for securing a semiconductor device component to another element is provided. An adhesive material includes a pressure-sensitive component and a curable component is used to at least temporarily secure the semiconductor device component and the other element to each other. The pressure-sensitive component of the adhesive material temporarily secures the semiconductor device component and the other element to one another. When the semiconductor device component and the other element are properly aligned, the curable component of the adhesive material may be cured to more permanently secure them to one another. For example, when a thermoset material is used as the curable component, it may be cured by heating, such as at a temperature of lower than about 200° C. and as low as about 120° C. or less.

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