Methods for reducing slurry usage in a linear chemical...

Details Methods for reducing slurry usage in a linear chemical... Methods for reducing slurry usage in a linear chemical...

2005-10-11

2005-10-11

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Abradant supplying

C451S446000, C451S036000

Reexamination Certificate

active

06953391

ABSTRACT:
Methods for dispensing slurry in a linear chemical mechanical planarization (CMP) system are provided. One method involves the use of a pulsing flow of slurry instead of a continuous flow of slurry. Another method involves spraying a mist of slurry onto the polishing pad. Yet another method involves controlling the gap between the nozzles from which the slurry is dispensed and the top surface of the polishing pad. Each of these methods reduces the amount of slurry used during a CMP operation.

REFERENCES:
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patent: 6284092 (2001-09-01), Manfredi
patent: 6589872 (2003-07-01), Twu et al.
patent: 6722943 (2004-04-01), Joslyn
patent: 2002/0022440 (2002-02-01), Kunugi
patent: 2002/0065022 (2002-05-01), Iwasaki et al.

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