Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate
2006-08-08
2006-08-08
Le, Dung A. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
C257S666000, C257S667000, C257S668000
Reexamination Certificate
active
07087984
ABSTRACT:
A method for protecting intermediate conductive elements, such as bond wires, of semiconductor device assemblies, includes sequentially fabricating one or more material layers of one or more protective structures to be associated with the intermediate conductive elements. After a first layer is formed, each subsequent layer is superimposed upon, contiguous with, and mutually adhered to an underlying layer of the protective structure.
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Le Dung A.
Micro)n Technology, Inc.
TraskBritt
LandOfFree
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