Methods for producing an aperture in a surface

Details Methods for producing an aperture in a surface Methods for producing an aperture in a surface

1984-10-12

1988-07-26

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

148DIG105, 148DIG111, 156656, 437184, 437912, H01L 2128, H01L 21288

Patent

active

047598220

ABSTRACT:
A method of electrolytic deposition of metal is used to decrease the minimum size pattern that can be obtained using photolithography. In the manufacture of integrated circuits, a layer of metal and then photoresist is deposited on the dielectric layer of the substrate prior to masking to define the gate apertures. After masking and etching through to the dielectric, metal is electrodeposited on the metal edges that abut the gate aperture, thus decreasing the aperture size. After that decreased gate dimension is etched into the dielectric to define the gate lengths of the semiconductor devices, the wafer is stripped and the subsequent manufacture proceeds in the conventional manner.

REFERENCES:
patent: 4077111 (1978-03-01), Driver et al.
patent: 4104111 (1978-08-01), Mack
patent: 4127709 (1978-11-01), Ruben
patent: 4145459 (1979-03-01), Goel
patent: 4256514 (1981-03-01), Pogge
patent: 4330343 (1982-05-01), Christou et al.
patent: 4389768 (1983-06-01), Fowler et al.
patent: 4495025 (1985-01-01), Haskell
patent: 4496419 (1985-01-01), Nulman et al.
patent: 4525919 (1985-07-01), Fabian
patent: 4536942 (1985-08-01), Chao et al.
patent: 4542577 (1985-09-01), Jackson
Jackson, T. N. et al., "A Novel Submicron Fabrication Technique", IEEE IEDM Sect. 3.6, Sep. 1979, pp. 58-61.

Affiliated with

Also associated with

Rating

Methods for producing an aperture in a surface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for producing an aperture in a surface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for producing an aperture in a surface will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-256625