Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Reexamination Certificate
2008-07-29
2008-07-29
Smith, Bradley K (Department: 2891)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
C438S149000, C438S510000, C438S515000, C257SE21582
Reexamination Certificate
active
07405111
ABSTRACT:
The present invention is to carry out stable doping and to prevent the drastic pressure change in a treatment chamber by reducing degasification of resist during adding impurities. In the present invention, the stability of the impurity ion injection can be ensured by reducing degasification of resist by reducing the area (resist area proportion, that is, the ratio of the area of resist to the whole area of a substrate) of resist pattern which is used depending on the conditions such as acceleration voltage or current density of a doping process.
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Specification, claims, abstract and drawings of U.S. Appl. No. 10/345,401 entitledMethod of Introducing lon and Method of Manufacturing Semiconductor Devicefiled Jan. 16, 2003.
Iwabuchi Tomoyuki
Nagao Shou
Ushitani Hitomi
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
Smith Bradley K
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