Methods for manufacturing alignment layer, active device...

Details Methods for manufacturing alignment layer, active device... Methods for manufacturing alignment layer, active device...

2006-09-20

2009-08-18

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S760000, C438S763000, C438S764000, C438S765000, C438S778000, C438S781000, C438S508000, C257S643000, C257S792000, C257SE21016, C257SE21019

Reexamination Certificate

active

07576015

ABSTRACT:
A method for manufacturing an alignment layer is provided, which includes the following steps. First, a substrate is provided. Next, an auxiliary layer is formed on the substrate. Then, an alignment solution is sprayed on the auxiliary layer through an inkjet printing process. The alignment solution includes an alignment material and a first solvent, and the auxiliary layer has the same polarity as the first solvent. Then, by performing a curing process, the alignment solution is cured to form an alignment layer. As mentioned above, the method for manufacturing an alignment layer may be applied to manufacture an alignment layer with preferred smoothness.

REFERENCES:
patent: 5447759 (1995-09-01), Murata et al.
patent: 5654780 (1997-08-01), Hasegawa et al.
patent: 2005/0271833 (2005-12-01), Matsumori et al.
patent: 09-105937 (1997-04-01), None
“Solubility”, Wikipedia, the Free Encyclopedia.

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