Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-05-25
1995-10-17
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156293, 156305, 156292, 26427211, 26427215, 264263, 264276, 257796, B29C 3910, B29C 4514, H01L 2313, H01L 2331
Patent
active
054587166
ABSTRACT:
A method is provided for forming a thermally enhanced molded cavity package of a type which includes a lid and which is for housing a microcircuit chip. The molded package includes a heat spreader and a lead frame. The method includes the steps of attaching the lead frame to one surface of the heat spreader. A mold press is secured or clamped to-the lead frame and to the opposite surface of the heat spreader. Molding compound is injected into the press to form the package body having an upper and a lower section. During molding, a cavity is provided in the package body having the first surface of the heat spreader as a cavity floor and a lid seat is constructed in the upper section of the package body for maintaining a lid received thereon substantially parallel with respect to the cavity floor. The heat spreader is bonded to at least one of the package body sections and to at least one of the leads of the lead frame.
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Alfaro Rafael C.
Heinen Katherine G.
Hundt Paul J.
Ball Michael W.
Brady III Wade James
Donalson Richard L.
Hashim Paul C.
Lorin Francis J.
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