Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-10-11
2005-10-11
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
C438S018000, C257SE21531
Reexamination Certificate
active
06953698
ABSTRACT:
Disclosed are methods for making microwave circuits using thickfilm components, the thickfilm components including: a first, multi-layer thickfilm dielectric deposited on a ground plane; a thickfilm conductor deposited on the first thickfilm dielectric; a second, multi-layer thickfilm dielectric deposited on the first dielectric and conductor to encapsulate the conductor; a thickfilm ground shield layer deposited over the first and second dielectrics; and thickfilm resistors deposited in close proximity to the first and second dielectrics.
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Botka Julius
Casey John F.
Dove Lewis R.
Drehle James R.
Johnson Rosemary O.
Agilent Technologie,s Inc.
Fourson George
Pham Thanh V.
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