Methods for forming small contacts

Details Methods for forming small contacts Methods for forming small contacts

2011-03-29

2011-03-29

Nguyen, Dao H (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S623000, C438S624000, C438S628000, C438S706000, C438S723000, C257S632000, C257S750000, C257S758000, C257S760000, C257SE21035, C257SE21038, C257SE21252, C257SE21257, C257SE21579

Reexamination Certificate

active

07915160

ABSTRACT:
Methods are provided for forming contacts for a semiconductor device. The methods may include depositing various materials, such as polysilicon, nitride, oxide, and/or carbon materials, over the semiconductor device. The methods may also include forming a contact hole and filling the contact hole to form the contact for the semiconductor device.

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