Methods for forming semiconductor devices so as to stabilize...

Details Methods for forming semiconductor devices so as to stabilize... Methods for forming semiconductor devices so as to stabilize...

2006-05-09

2006-05-09

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

C438S015000, C438S108000, C257S048000, C257S728000, C257S778000, C329S350000, C329S350000, C329S350000, C329S350000, C329S350000, C329S350000, C329S350000, C329S350000, C329S350000, C329S350000, C329S350000, C329S350000

Reexamination Certificate

active

07041513

ABSTRACT:
One or more of stabilizers are disposed on the surface of a semiconductor device or test substrate that includes bond pads or contact pads located at or proximate to a centerline thereof prior to bonding the semiconductor device face-down upon the test substrate. Upon assembly of the semiconductor device and test substrate, the stabilizers prevent the semiconductor device from tipping or tilting relative to the test substrate. The stabilizers may be preformed structures which are attached to a surface of a semiconductor device, test substrate, or both, or are fabricated on such a surface. Stereolithographic techniques may be used to fabricate the stabilizers. In addition, a machine vision system may be used in conjunction with the stereolithographic technique to recognize the position and orientation of a semiconductor device or test substrate on which the stabilizer is to be fabricated.

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