Methods for forming high density multi-chip carriers

Details Methods for forming high density multi-chip carriers Methods for forming high density multi-chip carriers

1991-03-01

1993-04-06

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430311, 437195, 437189, 428137, 428209, H01L 21283, H01L 21312

Patent

active

052003000

ABSTRACT:
A method for fabricating high density multi-chip carriers for integrated circuits includes the steps of forming a circuit pattern on a substrate, depositing a composite metal layer and a photoresist layer over the circuit pattern, forming apertures in the photoresist layer, forming solid metal vias in the apertures and, then, removing the photoresist layer. After removal of the first photoresist layer, a second photoresist layer is deposited over the solid vias and the circuit pattern. With the second photoresist layer in place, unprotected portions of the composite layer are etched away. Then, the second photoresist layer is stripped away. Next, a layer of photosensitive dielectric material is formed over the structure and, finally, sufficient portions of the photosensitive dielectric material are removed to expose the top surfaces of the solid vias.

REFERENCES:
patent: 5035939 (1991-07-01), Conlon et al.
patent: 5055425 (1991-10-01), Leibovitz

Affiliated with

Also associated with

Rating

Methods for forming high density multi-chip carriers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for forming high density multi-chip carriers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for forming high density multi-chip carriers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-535593