Methods for forming device structures on a wafer

Details Methods for forming device structures on a wafer Methods for forming device structures on a wafer

2011-01-11

2011-01-11

Walker, Amanda C. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S005000, C430S311000, C430S312000, C430S322000, C430S331000, C430S394000, C430S396000, C430S270100

Reexamination Certificate

active

07867693

ABSTRACT:
Methods for forming device structures on a wafer are provided. One method includes transferring approximately an inverse of patterned features formed in a positive resist layer on the wafer to a device material on the wafer to form the device structures in the device material. Another method includes transferring approximately an inverse of patterned features formed in a sacrificial layer on the wafer to a device material on the wafer to form the device structures in the device material.

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