Methods for forming contact hole, for manufacturing circuit...

Details Methods for forming contact hole, for manufacturing circuit... Methods for forming contact hole, for manufacturing circuit...

2007-04-03

2007-04-03

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S197000, C438S675000

Reexamination Certificate

active

11150290

ABSTRACT:
A method for forming a contact hole, a method for manufacturing a circuit board and a method for manufacturing an electro-optical device that increase the reliability of electrical coupling via a conductive part and prevent wire-breaking due to projections when forming a contact hole in an interlayer film by using a needle, and burying a conductive material in the contact hole is provided.

REFERENCES:
patent: 6690004 (2004-02-01), Miller et al.
patent: 6717181 (2004-04-01), Murakami et al.
patent: 2005/0181533 (2005-08-01), Kawase et al.
patent: 02-021507 (1990-01-01), None
patent: 10-096960 (1998-04-01), None
patent: 2000-260870 (2000-09-01), None
patent: 2003-127405 (2003-05-01), None
patent: 2000-0076824 (2000-12-01), None
patent: 2003-0035892 (2003-05-01), None
patent: WO 02/33740 (2002-04-01), None

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