Methods for fabricating stiffeners for flexible substrates

Details Methods for fabricating stiffeners for flexible substrates Methods for fabricating stiffeners for flexible substrates

2007-03-13

2007-03-13

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257SE21505, C257SE21516

Reexamination Certificate

active

11339377

ABSTRACT:
Methods for fabricating stiffeners for flexible substrates, including, but not limited to, tapes, films, or other connective structures, which are configured to be secured to other semiconductor device components, are fabricated under control of a program. The stiffeners may be formed by selectively depositing or consolidating unconsolidated material. They may include a plurality of mutually adhered regions. The stiffeners may be configured to prevent torsional flexion or bending of the connective structure to which they are to be secured, to reinforce sprocket or indexing holes in connective structures or to include apertures through which intermediate conductive elements or other structures secured to the connective structure may be exposed or protrude.

REFERENCES:
patent: 4865193 (1989-09-01), Shimamoto et al.
patent: 5173220 (1992-12-01), Reiff et al.
patent: 5264061 (1993-11-01), Juskey et al.
patent: 5278442 (1994-01-01), Prinz et al.
patent: 5397921 (1995-03-01), Karnezos
patent: 5409865 (1995-04-01), Karnezos
patent: 5484314 (1996-01-01), Farnworth
patent: 5663530 (1997-09-01), Schueller et al.
patent: 5705117 (1998-01-01), O'Connor et al.
patent: 5834338 (1998-11-01), Takeda et al.
patent: 5835355 (1998-11-01), Dordi
patent: 5843808 (1998-12-01), Karnezos
patent: 5844168 (1998-12-01), Schueller et al.
patent: 5915169 (1999-06-01), Heo
patent: 6002169 (1999-12-01), Chia et al.
patent: 6020221 (2000-02-01), Lim et al.
patent: 6025641 (2000-02-01), Park
patent: 6057174 (2000-05-01), Hashimoto
patent: 6251488 (2001-06-01), Miller et al.
patent: 6259962 (2001-07-01), Gothait
patent: 6268584 (2001-07-01), Keicher et al.
patent: 6380620 (2002-04-01), Suminoe et al.
patent: 6391251 (2002-05-01), Keicher et al.
patent: 6396136 (2002-05-01), Kalidas et al.
patent: 6509643 (2003-01-01), Ohtaka et al.
patent: 6537842 (2003-03-01), Akram
patent: 6544812 (2003-04-01), Camenforte et al.
patent: 6562661 (2003-05-01), Grigg
patent: 6593171 (2003-07-01), Farnworth
patent: 6746899 (2004-06-01), Grigg
patent: 6900078 (2005-05-01), Grigg
patent: 7029954 (2006-04-01), Grigg
patent: 2002/0171177 (2002-11-01), Kritchman et al.
patent: 2003/0151167 (2003-08-01), Kritchman et al.
patent: 2005/0064681 (2005-03-01), Wood et al.
patent: 2005/0064683 (2005-03-01), Farnworth et al.
patent: 11-186438 (1999-07-01), None
patent: 2001-044248 (2001-02-01), None
Miller et al., “Maskless Mesoscale Materials Deposition”, Deposition Technology, Sep. 2001, pp. 20-22.
Miller, “New Laser-Directed Deposition Technology,” Microelectronic Fabrication, Aug. 2001, p. 16.
Webpage, Objet Prototyping the Future, Objet FullCure 700 Series, 1 page.
Webpage, Objet Prototyping the Future, How it Works, 2 pages.

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