Methods for fabricating semiconductor components with...

Details Methods for fabricating semiconductor components with... Methods for fabricating semiconductor components with...

2011-05-31

2011-05-31

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S160000, C438S667000

Reexamination Certificate

active

07951702

ABSTRACT:
A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a substrate contact on the circuit side. The method also includes the steps of forming a substrate opening from the backside to the substrate contact, and then bonding the conductive interconnect to an inner surface of the substrate contact.

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