Methods for fabricating interposers including upwardly...

Details Methods for fabricating interposers including upwardly... Methods for fabricating interposers including upwardly...

2006-05-09

2006-05-09

Nguyen, Ha Tran (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S115000

Reexamination Certificate

active

07041532

ABSTRACT:
A method for fabricating an interposer includes providing an interposer substrate with at least one slot or aperture therethrough and forming at least one upwardly protruding dam on the interposer substrate, adjacent to the slot or aperture. The upwardly protruding dam or dams may at least partially surround the slot or aperture. Accordingly, the upwardly protruding dam or dams may laterally confine encapsulant material over the slot or aperture and over any intermediate conductive elements extending through the slot or aperture. Programmed material consolidation processes, such as stereolithography, may be used to form the at least one upwardly protruding dam.

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