Methods for fabricating fluid injection devices

Details Methods for fabricating fluid injection devices Methods for fabricating fluid injection devices

2006-02-17

2008-10-21

Le, Thao X. (Department: 2892)

Semiconductor device manufacturing: process

Formation of semiconductive active region on any substrate

C257SE21474

Reexamination Certificate

active

07439163

ABSTRACT:
Methods for fabricating fluid injection devices. A patterned sacrificial layer is formed on a substrate. A patterned first structural layer is formed on the substrate covering the sacrificial layer. At least one fluid actuator is formed on the structural layer. A first passivation layer is formed on the first structural covering the at least one fluid actuator. An under bump metal (UBM) layer is conformably formed on the first passivation layer. A patterned first photoresist is formed at a predetermined nozzle site and a contact opening site exposes the UBM layer. A second structural layer is formed on the UBM layer. An etching protective layer is formed on the second structural layer. The first photoresist is removed creating an opening at the nozzle site exposing the UBM layer. The UBM layer in the opening is removed.

REFERENCES:
patent: 6102530 (2000-08-01), Kim et al.

Affiliated with

Also associated with

Rating

Methods for fabricating fluid injection devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for fabricating fluid injection devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for fabricating fluid injection devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3992730