Methods for fabricating an electronic device

Details Methods for fabricating an electronic device Methods for fabricating an electronic device

2011-04-26

2011-04-26

Huynh, Andy (Department: 2829)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

C438S197000, C257S040000

Reexamination Certificate

active

07932186

ABSTRACT:
A method for fabricating an electronic device is provided. The method for fabricating the electrical device comprises providing a substrate. A patterned first self-assembled monolayer (SAM) and an adjacent patterned second SAM are formed on the substrate, wherein the patterned first SAM has a higher affinity then that of the patterned second SAM. A conductive, semiconductor or insulating material is dissolved or suspended in a solvent to form a solution. The solution is coated on the substrate. The solvent in the solution is removed to selectively form a patterned conductive, semiconductor or insulating layer on the patterned first SAM.

REFERENCES:
patent: 2007/0105396 (2007-05-01), Li et al.
patent: 2009/0298296 (2009-12-01), Burdinski
patent: 2010/0032657 (2010-02-01), Yanai et al.

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