Methods for encapsulating microelectromechanical (MEM)...

Details Methods for encapsulating microelectromechanical (MEM)... Methods for encapsulating microelectromechanical (MEM)...

2011-01-04

2011-01-04

Fulk, Steven J (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C257S415000, C257SE21002

Reexamination Certificate

active

07863070

ABSTRACT:
Apparatus and methods are provided for enabling wafer-scale encapsulation of microelectromechanical (MEM) devices (e.g., resonators, filters) to protect the MEMs from the ambient and to provide either a controlled ambient or a reduced pressure. In particular, methods for wafer-scale encapsulation of MEM devices are provided, which enable encapsulation of MEM devices under desired ambient conditions that are not determined by the deposition conditions of a sealing process in which MEM release via holes are sealed or pinched-off, and which prevent sealing material from being inadvertently deposited on the MEM device during the sealing process.

REFERENCES:
patent: 2001/0013653 (2001-08-01), Shoji
patent: 2005/0082654 (2005-04-01), Humpston et al.

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