Methods for developing high speed chip carriers with impedance m

Details Methods for developing high speed chip carriers with impedance m Methods for developing high speed chip carriers with impedance m

1986-02-10

1987-10-13

Kittle, John E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430316, 430317, 430318, 430330, 204 15, G03C 500

Patent

active

046998713

ABSTRACT:
A process for manufacturing a microcircuit carrier having resistive or capacitive lead terminations which comprises the steps of preparing a plate-up pattern on the substrate, laying out resistive lead terminations, capacitive lead terminations, or a combination of resistive and capacitive lead terminations, and packaging the carrier. The step of laying out resistive lead terminations comprises depositing resistor material along a resistive pattern, and laser trimming the resistor material to value. The step of laying out the capacitive lead terminations comprises depositing lower capacitor pads, hard anodizing said lower capacitor pads, and depositing the upper capacitor pads.

REFERENCES:
patent: 3893742 (1975-07-01), Blanchard et al.
patent: 3988648 (1976-10-01), Robinson
patent: 4339305 (1982-07-01), Jones

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