Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2006-02-07
2006-02-07
Schillinger, Laura M. (Department: 2813)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C438S014000, C438S018000
Reexamination Certificate
active
06995026
ABSTRACT:
A method and apparatus for supporting a microelectronic substrate. The apparatus can include a microelectronic substrate and a support member carrying the microelectronic substrate. The apparatus can further include a first connection structure carried by the support member. The first connection structure can have a first bond site configured to receive a flowable conductive material, and can further have at least two first elongated members connected and extending outwardly from the first bond site. Each first elongated member can be configured to receive at least a portion of the flowable conductive material from the first bond site, with none of the first elongated members being electrically coupled to the microelectronic substrate. The assembly can further include a second connection structure that is electrically coupled to the microelectronic substrate and that can include second elongated members extending away from a second bond site. The number of second elongated members can be equal to the number of first elongated members.
REFERENCES:
patent: 5062565 (1991-11-01), Wood et al.
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5145099 (1992-09-01), Wood et al.
patent: 5255156 (1993-10-01), Chang
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5444303 (1995-08-01), Greenwood et al.
patent: 5504373 (1996-04-01), Oh et al.
patent: 5544124 (1996-08-01), Zagar et al.
patent: 5554940 (1996-09-01), Hubacher
patent: 5593927 (1997-01-01), Farnworth et al.
patent: 5642262 (1997-06-01), Terrill et al.
patent: 5656863 (1997-08-01), Yasunaga et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5723906 (1998-03-01), Rush
patent: 5734559 (1998-03-01), Banerjee et al.
patent: 5792594 (1998-08-01), Brown et al.
patent: 5826628 (1998-10-01), Hamilton
patent: 5843799 (1998-12-01), Hsu et al.
patent: 5879965 (1999-03-01), Jiang et al.
patent: 5891797 (1999-04-01), Farrar
patent: 5936844 (1999-08-01), Walton
patent: 5946314 (1999-08-01), Licciardi et al.
patent: 5946553 (1999-08-01), Wood et al.
patent: 5986209 (1999-11-01), Tandy
patent: 5990566 (1999-11-01), Farnworth et al.
patent: RE36469 (1999-12-01), Wood et al.
patent: 6018249 (2000-01-01), Akram et al.
patent: 6020624 (2000-02-01), Wood et al.
patent: 6025728 (2000-02-01), Hembree et al.
patent: 6048744 (2000-04-01), Corisis et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6089920 (2000-07-01), Farnworth et al.
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6103547 (2000-08-01), Corisis et al.
patent: 6107122 (2000-08-01), Wood et al.
patent: 6108210 (2000-08-01), Chung
patent: 6111205 (2000-08-01), Leddige et al.
patent: 6118179 (2000-09-01), Farnworth et al.
patent: 6130474 (2000-10-01), Corisis
patent: 6133068 (2000-10-01), Kinsman
patent: 6133622 (2000-10-01), Corisis et al.
patent: 6148509 (2000-11-01), Schoenfeld et al.
patent: 6150710 (2000-11-01), Corisis
patent: 6150717 (2000-11-01), Wood et al.
patent: 6153924 (2000-11-01), Kinsman
patent: 6159764 (2000-12-01), Kinsman et al.
patent: 6180504 (2001-01-01), Farnworth et al.
patent: 6188232 (2001-02-01), Akram et al.
patent: 6201304 (2001-03-01), Moden
patent: 6201305 (2001-03-01), Darveaux et al.
patent: 6214716 (2001-04-01), Akram
patent: 6221750 (2001-04-01), Fjelstad
patent: 6225689 (2001-05-01), Moden et al.
patent: 6228548 (2001-05-01), King et al.
patent: 6229202 (2001-05-01), Corisis
patent: 6232147 (2001-05-01), Matsuki et al.
patent: 6232666 (2001-05-01), Corisis et al.
patent: 6235552 (2001-05-01), Kwon et al.
patent: 6239489 (2001-05-01), Jiang
patent: 6246108 (2001-06-01), Corisis et al.
patent: 6246110 (2001-06-01), Kinsman et al.
patent: 6247629 (2001-06-01), Jacobson et al.
patent: 6258623 (2001-07-01), Moden et al.
patent: 6258624 (2001-07-01), Corisis
patent: 6259153 (2001-07-01), Corisis
patent: 6261865 (2001-07-01), Akram
patent: 6265766 (2001-07-01), Moden
patent: 6271580 (2001-08-01), Corisis
patent: 6277660 (2001-08-01), Zakel et al.
patent: 6281042 (2001-08-01), Ahn et al.
patent: 6284571 (2001-09-01), Corisis et al.
patent: 6285204 (2001-09-01), Farnworth
patent: 6291894 (2001-09-01), Farnworth et al.
patent: 6297547 (2001-10-01), Akram
patent: 6300782 (2001-10-01), Hembree et al.
patent: 6303981 (2001-10-01), Moden
patent: 6303985 (2001-10-01), Larson et al.
patent: 6310390 (2001-10-01), Moden
patent: 6326698 (2001-12-01), Akram
patent: 6329222 (2001-12-01), Corisis et al.
patent: 6329705 (2001-12-01), Ahmad
patent: 6331221 (2001-12-01), Cobbley
patent: 6331448 (2001-12-01), Ahmad
patent: 6344976 (2002-02-01), Schoenfeld et al.
patent: 6362087 (2002-03-01), Wang et al.
patent: 6380555 (2002-04-01), Hembree et al.
patent: 6391681 (2002-05-01), Corisis
patent: 6392291 (2002-05-01), Corisis
patent: 6407459 (2002-06-01), Kwon et al.
patent: 6410990 (2002-06-01), Taylor et al.
patent: 6429528 (2002-08-01), King et al.
patent: 6455408 (2002-09-01), Hwang et al.
patent: 6477046 (2002-11-01), Stearns et al.
patent: 6682948 (2004-01-01), Wada
patent: 2002/0017711 (2002-02-01), Kwon et al.
patent: 2002/0139578 (2002-10-01), Alcoe et al.
patent: 2002/0195345 (2002-12-01), Bensten et al.
patent: 2002/0195614 (2002-12-01), Tay et al.
patent: 2003/0030965 (2003-02-01), Chua et al.
patent: 196 00 401 (1997-07-01), None
patent: 197 14 470 (1997-12-01), None
patent: 0 398 628 (1990-11-01), None
patent: 0 398 628 (1990-11-01), None
patent: 0 413 451 (1991-02-01), None
patent: 0 413 451 (1991-02-01), None
patent: WO 92/17901 (1992-10-01), None
Van Zant, Peter, “Microchip Fabrication: A Practical Guide to Semiconductor Processing,” p. 545, McGraw-Hill, New York, Third Edition, Oct. 1996, ISBN: 0070672504.
Harper, Charles A. and Miller, Martin B., “Electronic Packaging, Microelectronics, and Interconnection Dictionary,” p. 211, McGraw-Hill, New York, Feb. 1993, ISBN: 0070266883.
Kohl, James E. et al., “Low Cost Chip Scale Packaging and Interconnect Technology,” 7 pages, Proceedings of the Surface Mount International Conference, San Jose, California, Sep. 1997, <http://www.epic-tech.com/smtppr.pdf>.
Kohl, James E. et al., “EPIC CSP™ Assembly and Reliability Methods,” 5 pages, Proceedings of CSI98, Santa Clara, California, May 1998, <http://www.epic-tech.com/cspi982.pdf>.
Singer, Adam, T. et al., “Cost Considerations for CSP Variations,” 9 pages, presented at Chip Scale International, San Jose, California, May 1998, <http://www.epic-tech.com/ibis—papr.pdf>.
Tessier, Theodore G. et al., “Technologies and Trends in Wafer Level Packaging,” 15 pages. Future Fab International, vol. 11, Jun. 29, 2001, <http://www.future-fab.com/documents/asp?d—ID=660>.
Lau, John H., “Ball Grid Array Technology,” McGraw-Hill, Inc., Chapter 8, “Reliability of Ceramic Ball Grid Array Assembly,” 1995, pp. 224-265.
U.S. Appl. No. 10/034,924, filed Dec. 26, 2001, Moxham et al.
U.S. Appl. No. 10/153,086, filed May 22, 2002, King et al.
U.S. Appl. No. 10/775,703, filed Feb. 10, 2004, Moxham et al.
Moxham Stephen
Stephenson William
Doty Heather
Micro)n Technology, Inc.
Perkins Coie LLP
Schillinger Laura M.
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