Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2006-03-07
2006-03-07
Whithead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
With measuring or testing
C361S690000, C324S760020
Reexamination Certificate
active
07008804
ABSTRACT:
Methods for compensating for a test temperature deviation in a semiconductor device handler are provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing of the semiconductor device at a preset temperature is compensated for. This allows a test of the semiconductor device to be carried out at an exact temperature. The method includes fitting at least one semiconductor device to at least one test socket and starting a test, measuring in real time a temperature of the semiconductor device using a temperature sensor, detecting a measured temperature change rate and comparing the measured temperature change rate to a preset value, spraying cooling fluid onto the semiconductor device by controlling a cooling fluid supplying apparatus if the measured value change rate is higher than a preset value, and stopping spray of the cooling fluid onto the semiconductor device by controlling the cooling fluid supplying apparatus if the measured value change rate is below the preset value, thereby optimizing a test environment and improving yield.
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Ham Chul Ho
Lee Byeng Gi
Park Chan Ho
Song Jae Myeong
Dolan Jennifer M
Fleshner & Kim LLP
Mirae Corporation
Whithead, Jr. Carl
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