Methods for bonding and micro-electronic devices produced...

Details Methods for bonding and micro-electronic devices produced... Methods for bonding and micro-electronic devices produced...

2006-06-07

2009-06-16

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S615000, C438S612000, C438S614000

Reexamination Certificate

active

07547625

ABSTRACT:
One inventive aspect is related to a method of bonding two elements. The method comprises producing on a first element a first micropattern, comprising a first metal layer. The method further comprises producing on a second element a second micropattern, comprising a second metal layer. The method further comprises applying onto the first micropattern and/or on the second micropattern a layer of solder material. The method further comprises producing on at least one of the elements a patterned non-conductive adhesive layer around the micropattern on the element. The method further comprises joining the first micropattern and the second micropattern by means of a thermocompression or reflow method, wherein the producing of an adhesive layer is performed before the joining such that the first and second elements are secured to each other by the adhesive layer(s) after joining.

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