Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1994-08-05
1996-01-09
Nguyen, Nam
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20419212, C23C 1434
Patent
active
054826128
ABSTRACT:
An improved metal film deposition system is disclosed which comprises an improved shield (80) to prevent particulate contamination of processed wafers. The shield (80) includes an interstitial layer of flame-sprayed metal which adheres well to both the material comprising the metal film and the metal comprising the shield (80). Further, the shield utilizes radiused deflections (84) and (86) to disperse the forces created by the crystalline growth of the metal film.
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Armstrong Frank O.
Jeffreys Brian B.
Brady III Wade James
Donaldson Richard L.
Holland Robby T.
Nguyen Nam
Texas Instruments Incorporated
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