Methods and systems for packaging integrated circuits

Details Methods and systems for packaging integrated circuits Methods and systems for packaging integrated circuits

2011-01-04

2011-01-04

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S784000, C257SE23024

Reexamination Certificate

active

07863757

ABSTRACT:
Panel level methods and systems for packaging integrated circuits are described. In a method aspect of the invention, a substrate formed from a sacrificial semiconductor wafer is provided having a plurality of metallized device areas patterned thereon. Each device area includes an array of metallized contacts. Dice are mounted onto each device area and electrically connected to the array of contacts. The surface of the substrate including the dice, contacts and electrical connections is then encapsulated. The semiconductor wafer is then sacrificed leaving portions of the contacts exposed allowing the contacts to be used as external contacts in an IC package. In various embodiments, other structures, including saw street structures, may be incorporated into the device areas as desired. By way of example, structures having thicknesses in the range of 10 to 20 microns are readily attainable.

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