Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Reexamination Certificate
2005-06-28
2005-06-28
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
C216S027000, C216S058000, C216S065000, C216S067000, C219S161000
Reexamination Certificate
active
06911155
ABSTRACT:
The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.
REFERENCES:
patent: 4516315 (1985-05-01), Przybysz et al.
patent: 4721977 (1988-01-01), Fukae
patent: 4746935 (1988-05-01), Allen
patent: 4887100 (1989-12-01), Michaelis et al.
patent: 5081063 (1992-01-01), Vonno et al.
patent: 5160403 (1992-11-01), Fisher et al.
patent: 5266528 (1993-11-01), Yamada
patent: 5369060 (1994-11-01), Baumann et al.
patent: 5387314 (1995-02-01), Baughman et al.
patent: 5391236 (1995-02-01), Krut et al.
patent: 5408739 (1995-04-01), Altavela et al.
patent: 5441593 (1995-08-01), Baughman et al.
patent: 5455998 (1995-10-01), Miyazono et al.
patent: 5578418 (1996-11-01), Noguchi et al.
patent: 5658471 (1997-08-01), Murthy et al.
patent: 5678290 (1997-10-01), Good
patent: 5818481 (1998-10-01), Hotomi et al.
patent: 5825076 (1998-10-01), Kotvas et al.
patent: 5998234 (1999-12-01), Murata et al.
patent: 6041501 (2000-03-01), Suzuki et al.
patent: 6074048 (2000-06-01), Hotomi et al.
patent: 6113225 (2000-09-01), Miyata et al.
patent: 6117347 (2000-09-01), Ishida
patent: 6139132 (2000-10-01), Yasukawa et al.
patent: 6143190 (2000-11-01), Yagi et al.
patent: 6238269 (2001-05-01), Pollard et al.
patent: 6241335 (2001-06-01), Suzuki
patent: 6267904 (2001-07-01), Silverbrook
patent: 6271102 (2001-08-01), Brouillette et al.
patent: 6286938 (2001-09-01), Okano et al.
patent: 6291317 (2001-09-01), Salatino et al.
patent: 6312612 (2001-11-01), Sherman et al.
patent: 6318844 (2001-11-01), Witteveen et al.
patent: 6338284 (2002-01-01), Najafi et al.
patent: 6342401 (2002-01-01), Tom
patent: 6467876 (2002-10-01), Karasawa et al.
patent: 2003/0140497 (2003-07-01), Rivas et al.
patent: 0764533 (1997-03-01), None
patent: 0609012 (1997-05-01), None
patent: 0430593 (1999-06-01), None
patent: 1138491 (2001-10-01), None
patent: 11-198387 (1999-07-01), None
patent: 110198387 (1999-07-01), None
British Patent Office Search ReportUnder Section 17—GB0301949.4.
Buswell Shen
Enck Ronald L.
Hager Michael
Kawamura Naoto A.
Khavari Mehrgan
LandOfFree
Methods and systems for forming slots in a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods and systems for forming slots in a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and systems for forming slots in a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3505462