Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Reexamination Certificate
2005-01-11
2005-01-11
Gutierrez, Diego (Department: 2859)
Thermal measuring and testing
Leak or flaw detection
With heating or cooling of specimen for test
C374S124000, C324S501000, C324S765010, C324S701000, C382S149000, C250S341400, C250S341600
Reexamination Certificate
active
06840666
ABSTRACT:
Described are methods and systems for providing improved defect detection and analysis using infrared thermography. Test vectors heat features of a device under test to produce thermal characteristics useful in identifying defects. The test vectors are timed to enhance the thermal contrast between defects and the surrounding features, enabling IR imaging equipment to acquire improved thermographic images. In some embodiments, a combination of AC and DC test vectors maximize power transfer to expedite heating, and therefore testing. Mathematical transformations applied to the improved images further enhance defect detection and analysis. Some defects produce image artifacts, or “defect artifacts,” that obscure the defects, rendering difficult the task of defect location. Some embodiments employ defect-location algorithms that analyze defect artifacts to precisely locate corresponding defects.
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Belikov Sergey
Enachescu Marian
Behiel Arthur J.
Gutierrez Diego
Marena Systems Corporation
Pruchnic Jr. Stanley J.
Silicon Edge Law Group LLP
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