Methods and structures of providing modular integrated circuits

Details Methods and structures of providing modular integrated circuits Methods and structures of providing modular integrated circuits

2007-10-16

2007-10-16

Dinh, Paul (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C326S041000

Reexamination Certificate

active

10956544

ABSTRACT:
Modular wafers and integrated circuits (ICs), and methods of manufacturing modular ICs. A modular wafer can be optionally divided in various ways to avoid defects while producing a variety of modular ICs. A modular wafer includes an array of element dice separated by a scribe area. The scribe area includes interconnect lines that extend across the scribe area between each adjacent pair of the element dice. Unused interconnect lines can be pulled to a known value using weak pullups or pulldowns. Modular ICs can be manufactured with interconnect lines between each pair of adjacent element dice, in which case a single mask set can be used to manufacture a family of programmable logic devices (PLDs).

REFERENCES:
patent: 5914616 (1999-06-01), Young et al.
patent: 6157213 (2000-12-01), Voogel

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