Methods and devices for supporting substrates using fluids

Abrading – Abrading process

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S054000, C451S364000, C269S007000, C029S559000

Reexamination Certificate

active

07144299

ABSTRACT:
Electronic device support and processing methods are described. One embodiment includes a method of processing an electronic device including solder bumps extending therefrom. The method includes providing at least one fluid selected from the group consisting of electrorheological fluids and magnorheological fluids on a support structure. The solder bumps extending from the electronic device are positioned in the fluid. The fluid is activated by applying a field selected from the group consisting of an electric field and a magnetic field to the fluid. The activated fluid mechanically holds the electronic device in place. A surface of the electronic device is polished while the electronic device is held in place by the activated fluid. The fluid is deactivated by removing the applied field from the fluid, and the electronic device is separated from the deactivated fluid. Other embodiments are described and claimed.

REFERENCES:
patent: 3660949 (1972-05-01), Coes, Jr.
patent: 3953013 (1976-04-01), Griffith et al.
patent: 5505871 (1996-04-01), Harder et al.
patent: 5809987 (1998-09-01), Wark et al.
patent: 5947662 (1999-09-01), Becker et al.
patent: 6321739 (2001-11-01), Roberts
patent: 6553913 (2003-04-01), Wardlaw
patent: 6647611 (2003-11-01), Zhang
patent: 6806544 (2004-10-01), Liu
patent: 2006/0046433 (2006-03-01), Sterrett et al.
Mould et al., “A New Alternative for Temporary Wafer Mounting”, 2002 GaAsMANTECH Conference, (4 pages).
Monkman, “The electrorheological effect under compressive stress,” J. Phys. D: Appl. Phys. 28 (1995), pp. 588-593.
Takesue et. al., “Development and Experiments of Actuator Using MR Fluid,” IEEE Annual Conference on Industrial Electronics Society, 2000, pp. 1838-1843.
Tian et al., “Particulate volume effect in suspensions with strong electrorheological response,” Materials Letters 57 (2003), pp. 2807-2811.
Lord Corporation, “LORD Rheonetic™ Magnetically Responsive Technology Silicon-Based MR Fluid MRF-336AG Product Bulletin” (2004), (2 pages).
Yakoh et al., “Application of Electro-Rheological Fluids to Flexible Mount and Damper Devices,” Industrial Electronics Society, IECON 2000. 26th Annual Conference of the IEEE, vol. 3, Oct. 22-28, 2000, pp. 1815-1820.
Tian et al., “Mechanical property of electrorheological fluid under step compression,” J Appl. Phys, vol. 92, No. 11, Dec. 1, 2002, pp. 6875-6879.
Sproston et al., “Electrorheological Fluids in Dynamic Squeeze Flow,” Conference Record of the ICDL '96 12thInt'l Conf. on Conduction and Breakdown in Dielectric Liquids, Roma, Italy, Jul. 15-19, 1996, pp. 515-519.
Monkman, “Exploitation of Compressive Stress in Electrorheological Coupling,” Mechatronics, vol. 7, No. 1, 1997, pp. 27-36.
Monkman, “Addition of solid structures to electrorheological fluids,” J. Rheol 35(7), Oct. 1991, pp. 1385-1392.
Jordan et al., “Electrorheology,” IEEE Transaction on Electrical Insulation, vol. 24, No. 5, Oct. 1989, pp. 849-878.
Hanaoka et al., “Effects of Electrode Surface Morphology on Electrical Response of Electrorheological Fluids,” Proc. of 13thInt'l Conf. on Dielectric Liquids (ICDL '99), Nara, Japan, Jul. 20-25, 1999, pp. 418-422.
Block et al., “Electro-rheology,” J. Phys. D: Appl. Phys. 21 (1988), pp. 1661-1677.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods and devices for supporting substrates using fluids does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and devices for supporting substrates using fluids, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and devices for supporting substrates using fluids will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3697245

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.